TD3281
Random Phase Switching
800V
Triac Driver
TD3281 Solder Temperature Profile Recommendations
(1) Infrared Reflow:
Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow.
Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device
package should not exceed 250ºC:
G
F
D
E
H
B
A
C
Figure 1
Process
Step
Description
Parameter
A
B
C
D
E
F
Preheat Start Temperature (ºC)
Preheat Finish Temperature (ºC)
Preheat Time (s)
150ºC
180ºC
90 - 120s
230ºC
30s
260ºC
10s
<6ºC/s
Melting Temperature (ºC)
Time above Melting Temperature (s)
Peak Temperature, at Terminal (ºC)
Dwell Time at Peak Temperature (s)
Cool-down (ºC/s)
G
H
(2) Wave Solder:
Maximum Temperature:
Maximum Time:
260ºC (at terminal)
10s
Pre-heating:
100 - 150ºC (30 - 90s)
Single Occurrence
(3) Hand Solder:
Maximum Temperature:
Maximum Time:
350ºC (at tip of soldering iron)
3s
Single Occurrence
© 2013 Solid State Optronics • San José, CA
www.ssousa.com • +1.408.293.4600
Page 4 of 9
TD3281 /H/S/TR
Rev 2.00 (11/12/2013)
001698
SSOUSA [ SOLID STATE OPTRONIC ]
