Si535/536
Table 6. Environmental Compliance
The Si535/536 meets the following qualification test requirements.
Parameter
Mechanical Shock
Conditions/Test Method
MIL-STD-883, Method 2002
MIL-STD-883, Method 2007
MIL-STD-883, Method 2003
MIL-STD-883, Method 1014
MIL-STD-883, Method 2036
J-STD-020, MSL1
Mechanical Vibration
Solderability
Gross & Fine Leak
Resistance to Solder Heat
Moisture Sensitivity Level
Contact Pads
Gold over Nickel
Table 7. Thermal Characteristics
(Typical values TA = 25 ºC, VDD = 3.3 V)
Parameter
Symbol
Test Condition
Still Air
Min
—
Typ
84.6
38.8
—
Max
—
Unit
°C/W
°C/W
°C
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Ambient Temperature
JA
Still Air
—
—
JC
T
–40
—
85
A
Junction Temperature
T
—
125
°C
J
Table 8. Absolute Maximum Ratings1
Parameter
Maximum Operating Temperature
Supply Voltage, 2.5/3.3 V Option
Input Voltage (any input pin)
Symbol
Rating
85
–0.5 to +3.8
Unit
T
°C
V
AMAX
V
DD
V
–0.5 to V + 0.3
V
I
DD
Storage Temperature
T
–55 to +125
2500
°C
V
S
ESD Sensitivity (HBM, per JESD22-A114)
Soldering Temperature (Pb-free profile)2
ESD
T
260
°C
PEAK
Soldering Temperature Time @ TPEAK (Pb-free profile)2
t
20–40
seconds
P
Notes:
1. Stresses beyond those listed in Absolute Maximum Ratings may cause permanent damage to the device. Functional
operation or specification compliance is not implied at these conditions. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at
www.silabs.com/VCXO for further information, including soldering profiles.
Preliminary Rev. 0.6
5
SILICONIMAGE [ Silicon image ]
