Si500S
Package Specifications
Table 1. Package Diagram Dimensions (mm)
Dimension
Min
0.80
0.00
1.15
Nom
0.85
Max
0.90
0.05
1.25
Dimension
L1
Min
Nom
Max
0.10
0.10
0.10
0.08
0.10
0.05
A
A1
b
0.00
0.05
0.03
aaa
1.20
bbb
D
e
3.20 BSC
2.54 BSC
4.00 BSC
1.00
ccc
ddd
E
eee
L
0.95
1.05
Table 2. Pad Connections
Table 3. Tri-State/Powerdown/Driver Stopped
Function on OE (3rd Option Code)
1
2
3
4
OE
GND
Output
VDD
A
B
C
D
E
F
Open Active Active Active Active Active
Active
1
Tri-
State
Power-
down
Driver
Stopped
Active
Active
Active
Level
0
Tri-
Power-
down
Driver
Stopped
Active
Active
Active
Level State
0 C CC CC
T T T T T T
Y YWW
Dimension
(mm)
2.90
2.40
1.40
1.70
C1
E
X1
Y1
0 = Si500
CCCCC = mark code
TTTTTT = assembly manufacturing code
YY = year
WW = work week
Figure 2. Top Mark
Figure 1. Recommended Land Pattern
Rev. 1.1
3
SILICON [ SILICON ]
