SAW FILTER
HDBF16102A62 SF6-2
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2.
5-2 Low temperature exposure
Subject the device to -40℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2.
5-3 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high
temperature of +85℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in 2.2.
5-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall
meet the specifications in 2.2.
5-5 Solderability
Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%
area of the terminals must be covered with new solder. It shall meet the specifications in
2.2.
5-6 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1m 3 times. the device
shall fulfill the specifications in 2.2.
5-7 Vibration
Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude
of 1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in 2.2.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction
of the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
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