SAW FILTER
HDBF07009B24
5. ENVIRONMENTAL CHARACTERISTICS
5-1 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high
temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30 Minutes.
Then release the device into the room conditions for 1 to 2 hours prior to the measurement.
It shall meet the
5-2 Resistance to solder heat
Submerge the device terminals into the solder bath at 260℃ ±5℃ for 10±1 sec.
specifications in table 1.
Then release the device into the room conditions for 4 hours. It shall meet the specifications
in table 1.
5-3 Solderability
Submerge the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than
95% area of the soldering pad must be covered with new solder. It shall meet the
specifications in table 1.
5-4 Mechanical shock
Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the
filter shall fulfill the specifications in table 1.
5-5 Vibration
Subject the device to the vibration for 2 hour each in x,y and z axes with the amplitude
of 1.5 mm at 10 to 55 hz. The filter shall fulfill the specifications in table 1.
6. REMARK
6.1 Static voltage
Static voltage between signal load & ground may cause deterioration &destruction of
the component. Please avoid static voltage.
6.2 Ultrasonic cleaning
Ultrasonic vibration may cause deterioration & destruction of the component. Please
avoid ultrasonic cleaning
6.3 Soldering
Only leads of component may be soldered. Please avoid soldering another part of
component.
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