Preliminary
GM5BW97331A
■ Reliability and Quality Information
Sharp tests to a Reliability Confidence Level of 90%. These tables illustrate the test criteria and conditions, along
with the Number of Samples, the Number of Defectives, and the Lot Tolerance Percent Defective.
Samples Defective LTPD
No.
Test items
Temperature cycle
Test Conditions
(n)
22
22
22
22
22
(C)
(%)
10
10
10
10
10
1
2
3
4
5
-40°C (30 min) to +100°C (30 min), 100 cycles
0
High temp and high humidity storage Tstg = +60°C, RH = 90%, t = 1000 hr
0
High temperature storage
Low temperature storage
Operating test
Tstg = +100°C, t = 1000 hr
0
Tstg = -40°C, t = 1000 hr
0
Tc = +40°C, IF = 25 mA/chip, t = 1000 hr
0
15000 m/s2, 0.5 ms ±± ꢀ ±Y ꢀ ±Z direction,
3 times (Tc = 25°C)
6
Mechanical shock
11
0
20
200 m/s2, 100 to 2000 to 100 Hz / sweep for
4 min. ± ꢀ Y ꢀ Z direction, 4 times (Tc = 25°C)
7
8
Variable frequency vibration
11
11
0
0
20
20
Resistance to soldering temperatures Refer to the Soldering Profile; Performed twice
Solder/flux M705/ESR250 (Senju Metal Indus-
9
Solderability
try Co. Ltd.) Soldering temperature 245°C ±5°;
solder time 3 sec, 1 hr after Test 2 (above)
11
0
20
● Failure Judgement Criteria
No.
1
Items
Symbol
Failure judgment criteria (*2)
VF > U.S.L × 1.2
Forward voltage
Reverse current
VF
IR
Iv
2
IR > U.S.L × 2.0
2
Luminous intensity (*3)
Iv < Initial value × 0.5, Iv > Initial value × 2.0
*1 Measuring condition is in accordance with specification.
*2 U.S.L.: Upper Specification Limit.
*3 Solderability failure criterion: Fail if >90% solderability in plated test areas are not soldered.
Judgement areas are the bottom and sides as shown in Fig. 12.
Fig. 12 Solderability Judgment Areas
0.3
0.3
0.3
Lead Bends
NOTE: Units: mm
GM5BW97331A-14
8
SHARP [ SHARP ELECTRIONIC COMPONENTS ]
