General Description of Light Emitting Diodes
(4) Installation to the case
A
A: Lead Pin Type
■ Lead Forming Method
Do not fix part A with adhesives when
fixed to the case as shown in the figure.
A hole of the case should be designed not
to be smaller than the outside diameter of
LED lamp resin.
Avoid forming a lead pin with the lead pin base as a fulcrum: be sure to hold a
Case
lead pin firmly when forming.
Lead pins should be formed before soldering.
■ Soldering Conditions
Solder the lead pins under the following conditions.
Type of Soldering
1. Manual soldering
2. Wave soldering
Conditions
295˚C ± 5˚C, within 3 seconds
260˚C ± 5˚C, within 5 seconds
Hold a lead pin firmly when forming
Preheating 70˚C to 80˚C, within 30 seconds
Soldering 245˚C ± 5˚C, within 5 seconds
3. Reflow soldering
(Notes)¡Avoid dipping resin into soldering bath.
■ Installation
(1) Installation on a PWB
¡Avoid applying stress to lead pins while they are heated. For example, when the
LED lamp is moved with the heat applied to the lead pins during manual
soldering or solder repair, disconnection may occur.
When mounting an LED lamp on a PWB, do not apply physical stress to the lead
pins.
(Notes)¡The lead pin pitch should match the PWB pin-hole pitch: absolutely avoid
widening or narrowing the lead pins.
¡When positioning an LED lamp, basically employ an LED with tie-bar cut or
use a spacer.
Not acceptable
Acceptable
Soldering
iron
Not acceptable
PWB
■ Cleaning
(1) Solvents
The package resin may be penetrated by solvents used in cleaning. Refer to the
table below for usable solvents.
Acceptable
Solvent
Usable
™
™
×
Ethyl alcohol
Isopropyl alcohol
Chlorosen
(2) When an LED lamp is mounted directly on a PWB
If the bottom face of an LED lamp is mounted directly on single-sided PWB, the
base of the lead pins may be subjected to have
×
×
Acetone
Trichloroethylene
physical stress due to PWB warp, cutting or
™ : Acceptable
× : Not acceptable
clinching of lead pins. Prior to use, be sure to
(Notes)¡There is a world-wide movement to restrict the use of chrolofluorocarbon (CFC)
based solvents and we recommend that you avoid their use. However, before
using a CFC substitute solvent, carefully check that it will not penetrate the
package resin.
check that no disconnection inside of the resin
or damage to resin etc., is found.
1.6A
When an LED lamp is mounted on a double-
sided PWB, the heat during soldering affects
the resin; therefore, keep the LED lamp more
than 1.6mm afloat above the PWB.
(2) Cleaning Methods
Cleaning Method
Solvent cleaning
Usable
Remarks
Immersion up to one minute at room temperature
™
(3) Installation using a holder
During an LED lamp positioning, in case of
using a holder, holder A should be designed to
Test the cleaning under actual conditions and
check for abnormalities before actual use.
Ultrasonic cleaning
be smaller than the inside diameter of lead
pins. Holder B should be designed to be larger
Holder
™ : Acceptable
A
B
: Acceptability depends on device type and conditions
(Notes)¡The affect on the device from ultrasonic cleaning differs depending on the size
of the cleaning bath, ultrasonic output, duration, board size and device mounting
method. Test the cleaning method under actual conditions and check for
abnormalities before actual use.
than the outside diameter of lead pins.
(Notes)¡Pay attention to the thermal expansion
coefficient of the material used for the
holder. Since the holder expands and
contracts due to preheat and soldering
¡Cleaning with water is not allowed with the lead pins resin-tubulated: water may
remain, thus causing rust to the lead pins.
¡Please contact our representative before using a cleaning solvent or method not
given above.
heat, mechanical stress may be applied to the lead pins, resulting in
disconnection.
Notice
In the absence of confirmation by device specification sheets,SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in
catalogs,data books,etc.Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet address for Electronic Components Group http://www.sharp.co.jp/ecg/
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