PACKAGE/ORDERING INFORMATION
PACKAGE
DESCRIPTION
PACKAGE
OPTION
MARKING
INFORMATION
MODEL
CHANNEL
ORDER NUMBER
SGM8651XN5/TR
SGM8651XS/TR
SOT23-5
SO-8
Tape and Reel, 3000
Tape and Reel, 2500
8651
SGM8651
Single
SGM8651XS
SGM8652XMS/TR
SGM8652XS/TR
SGM8653XN6/TR
MSOP-8
SO-8
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
SGM8652XMS
SGM8652XS
8653
SGM8652
SGM8653
Dual
Single
with shutdown
SOT23-6
SGM8653XS/TR
SGM8654XS/TR
SGM8654XTS
SO-8
SO-16
TSSOP-16
Tape and Reel, 2500
Tape and Reel, 2500
Tape and Reel, 3000
SGM8653XS
SGM8654XS
SGM8654XTS
SGM8654
SGM8655
Quad
Dual
with shutdown
SGM8655XMS/TR
MSOP-10
Tape and Reel, 3000
SGM8655XMS
CAUTION
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V- ......................................... 7.5 V
Common-Mode Input Voltage
...................................... (–VS) – 0.5 V to (+VS) +0.5V
Storage Temperature Range..................–65℃ to +150℃
Junction Temperature ..............................................160℃
Operating Temperature Range............ –55℃ to +150℃
Package Thermal Resistance @ TA = 25℃
SOT23-5, θJA......................................................... 190℃/W
SOT23-6, θJA......................................................... 190℃/W
SO-8, θJA..................................................................125℃/W
MSOP-8, θJA.......................................................... 216℃/W
MSOP-10, θJA........................................................ 216℃/W
SO-16, θJA................................................................ 82℃/W
TSSOP-16, θJA....................................................... 105℃/W
Lead Temperature Range (Soldering 10 sec)
This integrated circuit can be damaged by ESD.
Shengbang Micro-electronics recommends that all
integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes could
cause the device not to meet its published
specifications.
..................................................... 260℃
ESD Susceptibility
HBM...........................................................................1000V
MM...............................................................................400V
NOTES
1. Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
３
SGM8651/2/3/4/5
SGMICRO [ Shengbang Microelectronics Co, Ltd ]
