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SGM8092XS/TR 参数 Datasheet PDF下载

SGM8092XS/TR图片预览
型号: SGM8092XS/TR
PDF下载: 下载PDF文件 查看货源
内容描述: 350MHz的轨至轨输出CMOS运算放大器 [350MHz, Rail-to-Rail Output CMOS Operational Amplifier]
分类和应用: 运算放大器
文件页数/大小: 17 页 / 687 K
品牌: SGMICRO [ Shengbang Microelectronics Co, Ltd ]
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PACKAGE/ORDERING INFORMATION  
PACKAGE  
DESCRIPTION  
SOT23-5  
SO-8  
PACKAGE  
OPTION  
MARKING  
INFORMATION  
8091  
SGM8091XS  
SGM8092XS  
SGM8092XMS  
8093  
SGM8093XS  
SGM8094XS  
SGM8094XTS  
MODEL  
SGM8091  
SGM8092  
SGM8093  
SGM8094  
ORDER NUMBER  
SGM8091XN5/TR  
SGM8091XS/TR  
SGM8092XS/TR  
SGM8092XMS/TR  
SGM8093XN6/TR  
SGM8093XS/TR  
SGM8094XS/TR  
SGM8094XTS  
Tape and Reel, 3000  
Tape and Reel, 2500  
Tape and Reel, 2500  
Tape and Reel, 3000  
Tape and Reel, 3000  
Tape and Reel, 2500  
Tape and Reel,2500  
Tape and Reel, 3000  
SO-8  
MSOP-8  
SOT23-6  
SO-8  
SO-16  
TSSOP-16  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage, V+ to V- ......................................... 7.5 V  
Common-Mode Input Voltage  
..................................... (–VS )– 0.5 V to (+VS) +0.5V  
Storage Temperature Range ................ –65℃ to +150℃  
Junction  
Temperature ............................................................. 160℃  
Operating Temperature Range ........... –55to +150℃  
Package Thermal Resistance @ TA = 25  
SOT23-5, θJA......................................................... 190/W  
SOT23-6, θJA.......................................................... 190/W  
SO-8, θJA..................................................................125/W  
MSOP-8, θJA.......................................................... 216/W  
SO-16, θJA................................................................ 82/W  
CAUTION  
This integrated circuit can be damaged by ESD.  
Shengbang Micro-electronics recommends that all  
integrated circuits be handled with appropriate  
precautions. Failure to observe proper handling and  
installation procedures can cause damage.  
ESD damage can range from subtle performance  
degradation to complete device failure. Precision  
integrated circuits may be more susceptible to  
damage because very small parametric changes  
could cause the device not to meet its published  
specifications.  
TSSOP-16, θJA....................................................... 105/W  
Lead Temperature Range (Soldering 10 sec)  
................................................ 260℃  
ESD Susceptibility  
HBM...........................................................................1000V  
MM...............................................................................400V  
NOTES  
1. Stresses above those listed under Absolute Maximum  
Ratings may cause permanent damage to the device. This is  
a stress rating only; functional operation of the device at  
these or any other conditions above those indicated in the  
operational section of this specification is not implied.  
Exposure to absolute maximum rating conditions for  
extended periods may affect device reliability.  
SGM8091/2/3/4