PACKAGE/ORDERING INFORMATION
ORDER
NUMBER
PACKAGE
DESCRIPTION
PACKAGE
OPTION
MARKING
INFORMATION
MODEL
SGM8067
SGM8067XS/TR
SO-8
Tape and Reel
SGM8067XS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V- . . . . . . . . . . . . . . . . . . . . . 7.5 V
Internal Power Dissipation
SO-8 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8 W
Common-Mode Input Voltage
. . . . . . . . . . . . . . . . . . . . (–VS) – 0.5 Vto (+VS) +0.5V
Storage Temperature Range . . . . . . . . .–65℃ to +150℃
Junction Temperature . . . . . . . . . . . . . . . .. . . . . . . .160℃
Operating Temperature Range . . . . . . –55℃ to +150℃
Lead Temperature Range (Soldering 10 sec)
CAUTION
This integrated circuit can be damaged by ESD. Sheng
Bang Micro Electronics recommends that all
integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes could
cause the device not to meet its published
specifications.
. . . . . . . . . . .. . . . . . . . . . . . . . . . 260℃
NOTES
1. Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
3
SGM8067
SGMICRO [ Shengbang Microelectronics Co, Ltd ]
