PACKAGE/ORDERING INFORMATION
PACKAGE
DESCRIPTION
PACKAGE
OPTION
MARKING
INFORMATION
MODEL
CHANNEL
ORDER NUMBER
SGM8051XN5/TR
SGM8051XS/TR
SOT23-5
SO-8
Tape and Reel, 3000
Tape and Reel, 2500
8051
SGM8051
Single
SGM8051XS
SGM8052XMS/TR
SGM8052XS/TR
SGM8053XN6/TR
MSOP-8
SO-8
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
SGM8052XMS
SGM8052XS
8053
SGM8052
SGM8053
Dual
Single
with shutdown
SOT23-6
SGM8053XS/TR
SGM8054XS14
SGM8054XTS14
SGM8054XS/TR
SGM8054XTS
SO-8
SO-14
TSSOP-14
SO-16
Tape and Reel, 2500
Tube, 50
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
SGM8053XS
SGM8054XS14
SGM8054XTS14
SGM8054XS
SGM8054
SGM8055
Quad
TSSOP-16
SGM8054XTS
Dual
with shutdown
SGM8055XMS/TR
MSOP-10
Tape and Reel, 3000
SGM8055XMS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V- ......................................... 7.5 V
Common-Mode Input Voltage
........................................ (–VS )– 0.5 V to (+VS) +0.5V
Storage Temperature Range ................ –65℃ to +150℃
Junction
Temperature ..............................................................160℃
Operating Temperature Range ........... –55℃ to +150℃
Package Thermal Resistance @ TA = 25℃
SOT23-5, θJA......................................................... 190℃/W
SOT23-6, θJA......................................................... 190℃/W
SO-8, θJA..................................................................125℃/W
MSOP-8, θJA.......................................................... 216℃/W
MSOP-10, θJA........................................................ 216℃/W
SO-16, θJA................................................................ 82℃/W
TSSOP-16, θJA....................................................... 105℃/W
Lead Temperature Range (Soldering 10 sec)
......................................... 260℃
ESD Susceptibility
HBM...........................................................................1000V
MM...............................................................................400V
NOTES
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect device reliability.
CAUTION
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes
could cause the device not to meet its published
specifications.
This integrated circuit can be damaged by ESD.
Shengbang Micro-electronics recommends that all
integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and
installation procedures can cause damage.
３
SGM8051/2/3/4/5
SGMICRO [ Shengbang Microelectronics Co, Ltd ]
