Typical Characteristics (continued)
2.5
2.0
1.5
1.0
0.5
0.0
1.2
1.1
1.0
* Note :
1. VGS = 0 V
0.9
∗ Note :
1. VGS = 10 V
2. ID = 250 µA
2. ID = 15 A
0.8
-100
-100
-50
0
50
100
150
200
-50
0
50
100
150
200
TJ, Junction Temperature [oC]
TJ, Junction Temperature [oC]
Figure 8. On-Resistance Variation
vs Temperature
Figure 7. Breakdown Voltage Variation
vs Temperature
30
25
20
15
10
5
Operation in This Area
is Limited by R DS(on)
102
101
100
100 µs
1 ms
10 ms
100 ms
DC
-1
10
* Notes :
1. TC = 25 oC
2. TJ = 175 o
C
3. Single Pulse
-2
10
0
25
100
101
102
50
75
100
125
150
175
VDS, Drain-Source Voltage [V]
TC, Case Temperature [ ℃]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs Case Temperature
D=0.5
100
0.2
※ Notes :
1. Zθ (t) = 3.1 ℃/W M a x .
JC
2. Duty Factor, D=t1/t2
0.1
3. TJM - TC = PDM * Zθ (t)
JC
0.05
-1
10
0.02
0.01
PDM
t1
single pulse
t2
-2
10
100
101
-5
10
-4
10
-3
10
-2
10
-1
10
t1, Square Wave Pulse Duration [sec]
Figure 11. Transient Thermal Response Curve
◎ SEMIHOW REV.A0,July 2005