Typical Characteristics (continued)
2.5
2.0
1.5
1.0
0.5
0.0
1.2
1.1
1.0
*
Note :
1. VGS = 0 V
0.9
0.8
*
Note :
1. VGS = 10 V
2. ID = 250 µA
2. ID = 2.1 A
-100
-50
0
50
100
150
200
-100
-50
0
50
100
150
200
TJ, Junction Temperature [oC]
TJ, Junction Temperature [oC]
Figure 8. On-Resistance Variation
vs Temperature
Figure 7. Breakdown Voltage Variation
vs Temperature
5
4
3
2
1
0
Operation in This Area
is Limited by R DS(on)
101
100
100 µs
1 ms
10 ms
100 ms
DC
-1
10
* Notes :
1. TC = 25 o
C
2. TJ = 150 o
C
3. Single Pulse
-2
10
100
101
102
103
25
50
75
100
125
150
TC, Case Temperature [oC]
VDS, Drain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs Case Temperature
100
D=0.5
0.2
* Notes :
0.1
1. ZθJC(t) = 1.25 oC/W Max.
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * ZθJC(t)
-1
10
0.05
0.02
0.01
single pulse
PDM
-2
10
t1
t2
100
101
-5
10
-4
10
-3
10
-2
10
-1
10
t1, Square Wave Pulse Duration [sec]
Figure 11. Transient Thermal Response Curve
◎ SEMIHOW REV.A0,Oct 2009
SEMIHOW [ SEMIHOW CO.,LTD. ]
