5036 series
MEASUREMENT CIRCUITS
ꢀ Note: Bypass capacitors specified in each measurement circuit below should be connected between VCC
and GND, and VCC2 and GND. Load resistance specified in each measurement circuit below should
be connected to OUT and OUTN pins (excluding measurement circuit 3).
Circuit wiring of bypass capacitors and load resistance should be connected as short as possible. If the
circuit wiring is long, the required characteristics may not be realized. Also, if the values of bypass
capacitors and load resistance differ from the description in this document or are not connected, the
required characteristics may not be realized.
Measurement Circuit 1
Measurement Circuit 3
0.01µF
(Ceramic chip capacitor)
0.01µF
(Ceramic chip capacitor)
ICC, ISTB
A
10µF
10µF
VCC
XIN
VCC2
OUT
IPD
RPD=VPD/IPD
VPD
IZ
A
2V
A
V
VCC
VCC2
OUT
SW1
Test point
Test point
SW2
R1
R1
VT
C1
IZ
A
Signal
XOUT
OE
OUTN
GND
OUTN
GND
Generator
OE
R1
IIH, IIL
A
VIH,VIL
Measurement Circuit 4
C1: 0.01ꢀF
R1: 49.9Ω
0.01µF
(Ceramic chip capacitor)
Measurement Circuit 2
10µF
0.01µF
(Ceramic chip capacitor)
2V
VCC
XIN
VCC2
OUT
10µF
R1
R1
VT
Duty1 (Differential)
2V
VCC
VCC2
OUT
R1
XOUT
OUTN
GND
Duty2,VOpp,tr,tf (Single ended)
VT
R1
XIN
OUTN
TEST GND
VOH,VOL
R1: 49.9Ω
R1: 49.9Ω
XIN = HIGH: OUT = HIGH, OUTN = LOW
XIN = LOW : OUT = LOW, OUTN = HIGH
SEIKO NPC CORPORATION —9
SEIKO [ SEIKO EPSON CORPORATION ]
