1N5913B Series
3 W DO−41 Surmetict 30
Zener Voltage Regulators
This is a complete series of 3 W Zener diodes with limits and
excellent operating characteristics that reflect the superior capabilities
of silicon−oxide passivated junctions. All this in an axial−lead,
transfer−molded plastic package that offers protection in all common
environmental conditions.
http://onsemi.com
Features
Cathode
Anode
• Zener Voltage Range − 3.3 V to 200 V
• ESD Rating of Class 3 (>16 KV) per Human Body Model
• Surge Rating of 98 W @ 1 ms
• Maximum Limits Guaranteed on up to Six Electrical Parameters
• Package No Larger than the Conventional 1 W Package
• Pb−Free Packages are Available
AXIAL LEAD
CASE 59
PLASTIC
STYLE 1
Mechanical Characteristics
CASE: Void free, transfer−molded, thermosetting plastic
FINISH: All external surfaces are corrosion resistant and leads are
readily solderable
MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES:
260°C, 1/16″ from the case for 10 seconds
MARKING DIAGRAM
A
1N
59xxB
YYWWG
G
POLARITY: Cathode indicated by polarity band
MOUNTING POSITION: Any
A
= Assembly Location
1N59xxB = Device Number
YY
WW
G
= Year
= Work Week
= Pb−Free Package
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
(Note: Microdot may be in either location)
Max. Steady State Power Dissipation
P
3
W
D
@ T = 75°C, Lead Length = 3/8″
Derate above 75°C
L
24
1
mW/°C
ORDERING INFORMATION
Steady State Power Dissipation
P
W
D
†
Device
Package
Shipping
@ T = 50°C
Derate above 50°C
A
6.67
mW/°C
°C
1N59xxB, G
Axial Lead
(Pb−Free)
2000 Units/Box
Operating and Storage
Temperature Range
T , T
−65 to
+200
J
stg
1N59xxBRL, G
Axial Lead
(Pb−Free)
6000/Tape & Reel
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
April, 2006 − Rev. 5
1N5913B/D
ROCHESTER [ Rochester Electronics ]
