RT7299B
Parameter
Symbol
Test Conditions
VFB Falling (Fault)
Min
--
Typ
91
Max
Unit
--
-
Power Good Falling
Threshold
%VREF
VFB Falling (Good)
--
106
Power Good Sink Current
Capability
PGOOD signal fault, IPGOOD sinks
2mA
--
--
--
--
--
30
0.6
--
0.3
100
1
V
Power Good Leakage
Current
PGOOD signal good, VPGOOD = 5.5V
nA
Minimum VIN for Indicating
PGOOD
VPGOOD 0.5V, IPGOOD sinks 100A
V
Minimum SS/TR Voltage
for Indicating PGOOD
2.6
Over-Temperature Protection
Thermal Shutdown
TSD
TSD
160
--
175
10
--
--
°C
Thermal Shutdown
Hysteresis
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright 2019 Richtek Technology Corporation. All rights reserved.
©
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
6
DS7299B-05 June 2019
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
