RT2101B
Parameter
Symbol
Test Conditions
PGOOD falling (Fault)
PGOOD rising (Good)
PGOOD rising (Fault)
PGOOD falling (Good)
Min
--
Typ
88
Max
--
Unit
--
93
--
Power Good Threshold
Voltage
%VREF
--
113
107
--
--
--
Switching Frequency Setting and External Synchronization (RT/SYNC pin)
RRT = 180k
Oscillator Frequency
840
1000
2200
1160
2450
kHz
kHz
RRT = 60k
1950
Switching Frequency Range
fSYNC
700
--
2000
in ExtSYNC Mode
MOSFET
High-Side MOSFET
VBOOT VSW = 5V
Resistance
--
--
45
42
60
55
m
m
Low-Side MOSFET
Resistance
Current Limit
Current Limit Threshold
ILIM
2.4
3.4
4.4
A
Over-Temperature Protection
Thermal Shutdown
Temperature
TSD
GBD (Note 5)
GBD (Note 5)
--
--
145
20
--
--
°C
°C
Thermal Shutdown
Hysteresis
TSD
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Guarantee by Design .
Copyright 2020 Richtek Technology Corporation. All rights reserved.
©
is a registered trademark of Richtek Technology Corporation.
DS2101B-06 March 2020
www.richtek.com
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