8-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
mm
Inches
Nom
Dimension
Min
2.87
2.87
1.14
0.79
0.62
0.47
0.47
1.07
Nom
3.0
Max
3.13
3.13
1.40
1.05
0.88
0.73
0.73
1.33
Min
Max
A
B
C
D
E
F
0.113
0.113
0.045
0.031
0.024
0.018
0.018
0.042
0.118
0.118
0.050
0.036
0.029
0.024
0.024
0.047
0.126
0.032
0.038
0.032
0.055
0.009
0.015
0.123
0.123
0.055
0.041
0.034
0.029
0.029
0.052
3.0
1.27
0.92
0.75
0.60
0.60
1.20
3.19
0.81
0.96
0.81
1.39
0.23
0.38
G
H
I
J
I
K
L
J
J
J
M
N
O
K
M
N
I
L
N
Case Materials
Materials
K
Solder Pad
Plating
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
O
O
Lid Plating
Body
2.0 to 3.0 µm Nickel
Al O Ceramic
2
3
Pb Free
PCB Footprint Top View
TOP VIEW
BOTTOM VIEW
8
E
B
8
C
1
2
3
7
7
6
5
1
2
3
H
A
6
5
G
4
4
D
F
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©2010 by RF Monolithics, Inc.
Page 4 of 5
SF2256E - 11/18/10
RFM [ RF MONOLITHICS, INC ]
