8-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
mm
Inches
Nom
0.118
0.118
-
Dimension
Min
2.87
2.87
-
Nom
3.00
3.00
-
Max
3.13
3.13
1.10
1.05
0.88
0.73
0.73
1.33
Min
0.113
0.113
-
Max
A
B
C
D
E
F
0.123
0.123
0.043
0.041
0.034
0.029
0.029
0.052
0.79
0.62
0.47
0.47
1.07
0.92
0.75
0.60
0.60
1.20
3.19
0.81
0.96
0.81
1.39
0.23
0.38
0.031
0.024
0.018
0.018
0.042
0.036
0.029
0.024
0.024
0.047
0.126
0.032
0.038
0.032
0.055
0.009
0.015
I
J
J
J
G
H
I
K
M
N
J
I
L
K
L
N
M
N
O
K
O
O
PCB Footprint Top View
Case Materials
Materials
Solder Pad
Plating
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating
Body
2.0 to 3.0 µm Nickel
Al O Ceramic
2
3
Pb Free
TOP VIEW
BOTTOM VIEW
C
E
B
8
8
1
2
3
7
7
6
5
1
2
3
H
A
6
5
G
4
4
D
F
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©2010 by RF Monolithics, Inc.
Page 4 of 5
SF2249E - 10/13/10
RFM [ RF MONOLITHICS, INC ]
