Surface Mount PPTC
FSMD1206 Series
RoHS
ü
THERMAL DERATING CURVE
Thermal Derating Curve, FSMD1206 Series
200%
150%
100%
50%
0%
-40
-20
0
20
40
60
80
Ambient Tempera ture (C)
TYPICAL TIME-TO-TRIPAT 23°C
A
B
C D
100
10
Z = FSMD005-1206
A = FSMD010-1206
B = FSMD020-1206
C = FSMD035-1206
D = FSMD050-1206
1
Z
0.1
0.01
0.001
0.1
1
10
100
Fault current (A)
PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS
The dimension in the table below provide the recommended pad layout for each FSMD1206 device
NOMINAL PAD DIMENSIONS (MILLIMETERS)
SOLDER REFLOW
20 to 40 Seconds
260 °C
Ramp-down
6°C/Second Max
Ramp-up
3°C/Second Max
1.9
217 °C
f
200 °C
150 °C
Preheat
1.0
1.0
25 °C
2.0
60 to 180 Seconds
60 to 150 Seconds
Solder Reflow
Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned by using standard industry methods and solvents.
5. Storage Environment: <30°C / 60%RH
Caution:
If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.
Rework:
Use standard industry practices.
NOTE: All Specification subject to change without notice.
C5ED01
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REV 2007.8.14
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