Surface Mount PPTC
FSMD 1812 Series
RoHS
ü
THERMAL PRODUCT DIMENSIONS (MILLIMETERS)
Thermal Derating Curve, FSMD Series
200%
150%
100%
A= FSMD 075, 110, 110-16, 125, 150
A
160 & 200
50%
B= FSMD 014, 020, 035 & 050
B
0%
4-0
2-0
0
20
40
60
80
Ambient Temperature (C)
TYPICAL TIME-TO-TRIPAT 23°C
A = FSMD014
B = FSMD020
C = FSMD035
D = FSMD050
E = FSMD075
F = FSMD110/110-16
G = FSMD125
H = FSMD150
I = FSMD160
A
B
C
D E FGH I J
100
10
1
0.1
0.01
0.001
0.1
1
10
100
Fault current (A)
J
FSMD200
PAD LAYOUTS, SOLDER REFLOW AND REWORK RECOMMENDATIONS
The dimensions in the table below provide the recommended pad layout for each FSMD 1812 device
NOMINAL PAD DIMENSIONS (MILLIMETERS)
SOLDER RELOW
20 to 40 Seconds
260 °C
Ramp-down
6°C/Second Max
Ramp-up
3°C/Second Max
3.5
217 °C
f
200 °C
150 °C
Preheat
1.78
1.78
25 °C
3.45
60 to 180 Seconds
60 to 150 Seconds
Solder Reflow
Due to “Lead Free” nature, up to 40 seconds dwelling time for the soldering zone is strongly recommended.
1. Recommended reflow methods; IR, vapor phase oven, hot air oven.
2. The FSMD Series are suitable for use with wave-solder application methods. (Top side only)
3. Recommended maximum paste thickness is 0.25mm.
4. Devices can be cleaned by using standard industry methods and solvents.
5. Storage Environment: <30°C / 60%RH
Caution:
If reflow temperatures exceed the recommended profile, devices may not meet performance requirements.
Rework:
Use standard industry practices.
C5ED04
REV 2007.8.14
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