MIL-M-38510/110C
1.5 Power and thermal characteristics.
Case outlines
Maximum allowable power
dissipation
Maximum
Maximum
θ
θ
JA
JC
A, D
C
60°C/W
35°C/W
25°C/W
140°C/W
350 mW at T = +125°C
A
120°C/W
400 mW at T = +125°C
A
Z
176°C/W still air
116°C/W 500 LFPM
350 mW at T = +125°C
A
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this specification
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the
Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
- Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the above specifications and standards are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein the
text of this document shall takes precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
3
RAYTHEON [ RAYTHEON COMPANY ]
