AND4YA
Ultra Bright LED Lamps: Type 2
Weight: 2.0 mg
Unit: mm
AND4YA
Cathode
Index
1.25
1.1
0.6
InGaAlP Ultra Bright Yellow Light Emission
Surface Mount Package
Features
• Small package size
• 2.0 (l) x 1.25 (w) x 1.1 (h) size
• Suitable for DIP and REFLOW soldering
• Recommended Forward Current: 10 mA
• RoHS Compliant
Maximum Ratings (T
a
= 25°C)
Characteristics
Forward Current
Symbol
I
F
V
R
P
D
T
Opr
T
Stg
2.0
1.4
Rating
25
5
70
-40 to 85
-40 to 90
Unit
mA
V
mW
°C
°C
0.4±0.2
Reverse Voltage
Power Dissipation
Operating Temperature Range
Polarity
Storage Temperature Range
Electro-Optical Characteristics (T
a
= 25°C)
Characteristics
Forward Voltage
Reverse Current
Luminous Intensity
Peak Emission Wavelength
Spectral Line Half Width
Dominant Wavelength
Full Viewing Angle
Precaution
Symbol
V
F
I
R
I
V
l
P
∆λ
λ
d
θ
Test Condition
I
F
= 20 mA
V
R
= 5 V
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
I
V
= 1/2 Peak
Minimum
–
–
58
–
–
–
–
Typical
2.1
–
80
591
15
589
140
Maximum
2.4
10
–
–
–
–
–
Unit
V
µA
mcd
nm
nm
nm
degree
Please be careful of the following:
1. Manual soldering: maximum temperature of iron tip: 260°C max.
Soldering time: within 5 sec. per solder-land
Soldering portion of lead: up to 1.6 mm from the body of the device
2. Reflow solder: recommended condition is as follows:
10 sec. max.
Temperature
140 - 160°C
230°C max.
Product specifications contained herein may be
changed without prior notice. It is therefore
advisable to contact Purdy Electronics before
proceeding with the design of equipment
incorporating this product.
The following soldering patterns are
recommended for reflow and dip soldering
Reflow
more than 2 min.
Time
4°C/sec.
max.
1.2
0.9
1.2
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085
Tel: 408.523.8200 • Fax: 408.733.1287 • email@purdyelectronics.com • www.purdyelectronics.com
1.2
7/18/07