May 2005
ASM2I99448
rev 0.3
multiple lines, the situation in Figure 4 “Optimized Dual
Line Termination” should be used. In this case, the series
terminating resistors are reduced such that when the
parallel combination is added to the output buffer
impedance the line impedance is perfectly matched.
Increased power consumption will increase the die
junction temperature and impact the device reliability
(MTBF). According to the system-defined tolerable
MTBF, the die junction temperature of the ASM2I99448
needs to be controlled and the thermal impedance of the
board/package should be optimized.The power dissipated
in the ASM2I99448 is represented in equation 1.
ASM2I99448
Z0=50ꢀ
RS=16ꢀ
OUTPUT BUFFER
Where ICCQ is the static current consumption of the
ASM2I99448, CPD is the power dissipation capacitance
17ꢀ
Z0=50ꢀ
per output, (Μ)ΣCL represents the external capacitive
output load, N is the number of active outputs (N is
always 12 in case of the ASM2I99448). The ASM2I99448
supports driving transmission lines to maintain high signal
integrity and tight timing parameters. Any transmission
line will hide the lumped capacitive load at the end of the
board trace, therefore, ΣCL is zero for controlled
transmission line systems and can be eliminated from
equation 1. Using parallel termination output termination
results in equation 2 for power dissipation.
RS=16ꢀ
17Ω + 16Ω || 16Ω = 50Ω || 50Ω
25Ω = 25Ω
Figure 4. Optimized Dual Line Termination
Power Consumption of the ASM299448 and
Thermal Management
The ASM2I99448 AC specification is guaranteed for the
entire operating frequency range up to 350MHz. The
ASM2I99448 power consumption and the associated
long-term reliability may decrease the maximum
frequency limit, depending on operating conditions such
as clock frequency, supply voltage, output loading,
ambient temperature, vertical convection and thermal
conductivity of package and board. This section
describes the impact of these parameters on the junction
temperature and gives a guideline to estimate the
ASM2I99448 die junction temperature and the associated
device reliability.
In equation 2, P stands for the number of outputs with a
parallel or thevenin termination, VOL, IOL, VOH and IOH
are a function of the output termination technique and
DCQ is the clock signal duty cycle. If transmission lines
are used ΣCL is zero in equation 2 and can be
eliminated. In general, the use of controlled transmission
line techniques eliminates the impact of the lumped
capacitive loads at the end lines and greatly reduces the
power dissipation of the device. Equation 3 describes the
die junction temperature TJ as a function of the power
consumption.
Table 9. Die junction temperature and MTBF
Where Rthja is the thermal impedance of the package
(junction to ambient) and TA is the ambient temperature.
According to Table 9, the junction temperature can be
used to estimate the long-term device reliability. Further,
combining equation 1 and equation 2 results in a
maximum operating frequency for the ASM2I99448 in a
series terminated transmission line system, equation 4.
Junction temperature (°C)
MTBF (Years)
100
110
120
130
20.4
9.1
4.2
2.0
P
= ICCQ + VCC ⋅ fCLOCK ⋅ N ⋅ C
+
C
⋅VCC
Equation1
L
∑
TOT
PD
M
P
=VCC ⋅ ICCQ + VCC ⋅ fCLOCK ⋅ N ⋅ C
+
C
+
[
∑
P
DC ⋅ I
(
VCC −VOH
)
+
(
1− DCQ
)
⋅ IOL ⋅VOL
]
Equation 2
Equation3
L
∑
TOT
PD
Q
OH
M
TJ = TA + P ⋅ Rthja
TOT
TJMAX − TA
1
(
)
fCLOCKMAX
=
⋅
− ICCQ ⋅VCC
Equation 4
CPD ⋅ N ⋅VC2C
Rthja
3.3V/2.5V LVCMOS 1:12 Clock Fanout Buffer
8 of 15
Notice: The information in this document is subject to change without notice.
PULSECORE [ PulseCore Semiconductor ]
