LNK64x4-64x8
Absolute Maximum Ratings(1,5)
DRAIN Voltage ........................................................-0.3 V to 725 V Notes:
DRAIN Pin Peak Current: LNK64x4............................ 400 (600) mA(4) 1. All voltages referenced to SOURCE, TA = 25 °C.
LNK64x5.............................504 (750) mA(4) 2. Duration not to exceed 2 ms.
LNK64x6 ............................654 (980) mA(4) 3. 1/16 in. from case for 5 seconds.
LNK64x7...........................670 (1003) mA(4) 4. The higher peak DRAIN current is allowed while the DRAIN voltage
LNK64x8........................... 718 (1076) mA(4)
is simultaneously less than 400 V.
Peak Negative Pulsed Drain Current.................................. -100 mA(2) 5. Maximum ratings specified may be applied, one at a time without
FEEDBACK Pin Voltage .................................................-0.3 to 9 V(6)
FEEDBACK Pin Current .........................................................100 mA
BYPASS Pin Voltage ........................................................ -0.3 to 9 V
causing permanent damage to the product. Exposure to Absolute
Maximum ratings for extended periods of time may affect product
reliability.
BYPASS Pin Current ...............................................................10 mA 6. -1 V for current pulse ≤5 mA out of the pin and a duration
Storage Temperature ................................................. -65 to 150 °C
of ≤500 ns.
Operating Junction Temperature(7) ...............................-40 to 150 °C 7. Normally limited by internal circuitry.
Lead Temperature ..............................................................260 °C(3)
Thermal Resistance
Thermal Resistance: D Package:
Notes:
(qJA) .............................100 °C/W(2), 80 °C/W(3) 1. Measured on pin 8 (SOURCE) close to plastic interface.
(qJC)(1) ...............................................30 °C/W 2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.
3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.
4. Free standing with no heat sink.
5. Measured at the back surface of tab.
6. Soldered (including exposed pad for K package) to typical
application PCB with a heat sinking area of 0.36 sq. in.
(232 mm2), 2 oz. (610 g/m2) copper clad.
7. Soldered (including exposed pad for K package) to typical
application PCB with a heat sinking area of 1 sq. in. (645 mm2),
2 oz. (610 g/m2) copper clad.
E Package
(qJA)..................................... 105 °C/W(4)
(qJC).........................................2 °C/W(5)
K Package
(qJA) .....................45 °C/W(6), 38 °C/W(7)
(qJC).........................................2 °C/W(5)
Conditions
SOURCE = 0 V; TJ = 0 to 100 °C
(Unless Otherwise Specified)
Parameter
Symbol
Min
Typ
Max
Units
Control Functions
TJ = 25 °C
tON × IFB = 1.4 mA-ms
Programmable
Maximum Frequency
fOSC
VFB = VFBth
85
kHz
Hz
See Notes A, F
LNK64x4-64x6
LNK64x7
350
760
560
Minimum Operation
Frequency
TJ = 25 °C
VFB = VFBth
fOSC(MIN)
LNK64x8
Frequency Ratio
(Constant Current)
TJ = 25 °C
Between VFB = 1.3 V and VFB = 1.9 V
fRATIO(CC)
1.42
1.16
1.47
1.21
1.53
1.26
Frequency Ratio
(Inductance
Correction)
Between tON × IFB = 1.4 mA and
tON × IFB = 2 mA-ms
fRATIO(IC)
Peak-to-Peak Jitter Compared to Average
Frequency, TJ = 25 °C
Frequency Jitter
±7
%
%
Maximum Duty Cycle
DCMAX
See Notes D, E
55
LNK6404/6405/
1.915
1.955
1.940
1.980
1.965
2.005
TJ = 25 °C
6406/6446
FEEDBACK Pin Voltage
VFBth
V
CBP = 1 mF
LNK6415/6416
8
Rev. C 03/16
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