牛津半导体有限公司
OXmPCI954
10.3注册DESCRIPTION............................................................................................................................................... 88
10.3.1
并行端口数据寄存器“ PDR ” ................................................................................................................. 88
10.3.2
ECP FIFO地址/ RLE ......................................................................................................................................... 88
10.3.3
器件状态寄存器“ DSR ” ............................................................................................................................ 88
10.3.4
设备控制寄存器‘DCR’......................................................................................................................... 89
10.3.5
EPP地址寄存器' EPPA “ ............................................................................................................................. 89
10.3.6
EPP数据寄存器“ EPPD1-4 ” ............................................................................................................................. 89
10.3.7
ECP数据FIFO ........................................................................................................................................................... 89
10.3.8
测试FIFO .................................................................................................................................................................... 89
10.3.9
配置的寄存器................................................................................................................................. 89
10.3.10配置B寄存器................................................................................................................................. 89
10.3.11扩展寄存器‘ECR’................................................................................................................... 90
11
11.1规格............................................................................................................................................................... 91
11.1.1
ZONE 0 ：头........................................................................................................................................................ 92
11.1.2
第一区：本地配置REGISTERS....................................................................................................... 93
11.1.3
第二区：标识寄存器..................................................................................................................... 94
11.1.4
ZONE 3 ： PCI配置寄存器............................................................................................................ 94
11.1.5
区域4 ：电源管理数据
（和DATA_SCALE区） ............................................. ................ 95
11.1.6
ZONE 5 ：功能访问.................................................................................................................................... 95
串行EEPROM ............................................................................................................................ 91
12
12.1
工作条件............................................................................................................. 97
DC电气特性.......................................................................................................................... 97
13
13.1
13.2
13.3
交流电气CHARACTERISTICS.......................................................................................... 99
PCI总线............................................................................................................................................................................ 99
LOCAL BUS...................................................................................................................................................................... 99
串行端口.............................................................................................................................................................. 101
14
15
15.1
15.2
时序WAVEFORMS................................................................................................................... 102
包装INFORMATION............................................................................................................ 117
160 -PIN LQFP................................................................................................................................................................. 117
176 -PIN VBGA ................................................................................................................................................................ 118
16
订购信息.......................................................................................................... 119
DS -0019 6月05
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OXFORD [ OXFORD SEMICONDUCTOR ]
