OXCFU950 DATA SHEET
OXFORD SEMICONDUCTOR, INC.
Pin Number
Pad TypeNote 1
Pin Name
Description
is enabled, upon de-assertion of the DSR# pin, the transmitter completes
the current character & enters idle mode until the DSR# pin is
reasserted. Note: flow control characters are transmitted regardless of
the state of the DSR# pin.
57
1
I_C_33_5_N_
P_33
RI#
Active-low modem ring-indicator input.
Power supply to UART and MIO I/O interfaces. Voltage on these pins
should be tied to 1.8 V to 3.3 V supply (depending on requirement).
UART_VDD3V3
Crystal Oscillator / PLL pinsNote4
51
50
A_18
A_18
XTLO
XTLI
Crystal oscillator output.
Crystal oscillator input. Frequency = 12 MHz.
Note : a pull-down resistor of 500 KΩ is required on this pin.
Ground (0 Volts) for PLL & oscillator cells. This pin should be tied to
ground.
Power supply for PLL & oscillator cells. This pin should be tied to 1.8
volts (i.e. tied to REG_VDD1V8 pin).
49
48
P_18
P_18
PLL_VSS1V8
PLL_VDD1V8
USBNote 5
2
3
4
A_33
A_33
P_33
USB_DP
USB_DM
USB_VDD3V3
USB data plus.
USB data minus.
Power supply to USB I/O interface. This pin should be tied to 3.3 volts.
Multi-Purpose I/ONote 3
64,63,62,61
B_T_33_5_N_1_ MIO[3:0]
Multipurpose IO pins.
Note: if enabled, MIO[3:0] can be used as an interrupt inputs.
MIO[3:2] can be configured to act as the USB power management
control signals PORT_OVER_CURRENT & PORT_POWER
Miscellaneous Pins/PadsNote2
52
20
I_C_33_5_N_U
I_C_33_5_N_D
CIS_MODE
TEST
Test mode select pin/default CIS select. (See Section 5.1)
Test pin. This pin should be tied to VSS for normal operation.
Additional Power and Ground
65 (Thermal bonding P_00
pad)
VSS
Main digital ground pin. The VSS pin should be tied to ground. Note this
is the thermal bonding pin underneath the 64-pin QFN package
Output supply from internal voltage regulator at 1.8 V. Can be used as
power supply to PLL (i.e. pin #48).
27
P_18
REG_VDD1V8
Table 1: Pin Descriptions
Note 1 : Pad syntax description
Pad type
syntax
Digital Input pad
Digital Output pad
Digital Tristate output pad
Digital Bidirectional pad
Analogue pad
t_a_xy_h_i_p
t_a_xy_d
t_a_xy_d
t_a_xy_h_i_d_p
t_xy
t_xy
Power Pad
Table 2: Pad Type Syntax
DS-0023 February 2007
External—Free Release
Page 12 of 74
OXFORD [ OXFORD SEMICONDUCTOR ]
