Version 1.1
GD DASPA2.14
Reflow Soldering Profile
Reflow-Lötprofil
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T
250
T
245 ˚C
p
240 ˚C
tP
tL
217 ˚C
200
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s
300
t
OHA04612
Pb-Free (SnAgCu) Assembly
Profile Feature
Profil-Charakteristik
Symbol
Symbol
Unit
Einheit
Minimum
Recommendation
Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2
3
K/s
Time tS
TSmin to TSmax
tS
60
100
2
120
3
s
Ramp-up rate to peak*)
K/s
TSmax to TP
TL
tL
Liquidus temperature
217
80
°C
s
Time above liquidus temperature
Peak temperature
100
TP
tP
245
20
260
30
°C
s
Time within 5 °C of the specified peak
temperature TP - 5 K
10
3
6
K/s
s
Ramp-down rate*
TP to 100 °C
480
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
2017-12-12
13
OSRAM [ OSRAM GMBH ]
