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CE & Discharge Function Selection Table
EEE
CODE
NHF
NLF
NHN
NLN
UHF
ULF
EN Type
EEE
CODE
UHN
ULN
DHF
DLF
EN Type
Discharge
Discharge
Type 1
None
None
None
None
Type 2
Type 1
Pull High
Pull High
Pull Low
Pull Low
Pull Low
Pull Low
Type 2
High Active
Low Active
High Active
Low Active
High Active
Low Active
Fast
Fast
Normal
Normal
Fast
High Active
Low Active
High Active
Low Active
High Active
Low Active
Normal
Normal
Fast
Fast
Normal
Normal
Pull High
Pull High
DHN
DLN
Fast
Block Diagram
Absolute Maximum Ratings
Parameter
Symbol
Ratings
9.0
1.0
+155
155
333
Units
V
Input Voltage VIN to GND
Output Current Limit, I(LIMIT)
Junction Temperature
VIN
ILIMIT
TJ
A
oC
SOT‐25
SC‐70‐5
SOP‐8
Thermal Resistance
oC/W
θJA
60
SOT‐25
SC‐70‐5
SOP‐8
350
250
1670
‐40 ~ +85
‐55~+150
+260
Power Dissipation
PD
mW
Operating Ambient Temperature
Storage Temperature
Lead Temperature (soldering, 10sec)
NOTES:
TOPR
TSTG
‐
oC
oC
oC
1
The power dissipation values are based on the condition that junction temperature TJ and ambient temperature TA difference is
100°C.
2
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended
operating conditions” is not implied. Exposure to absolute‐maximum –rated conditions for extended periods may affect device
reliability.
DS‐RS7302‐02 September, 2009
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