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DIP-8L Dimension
DIM
A
Min.
Max.
6.40
9.32
*1.52
*1.27
*0.99
3.35
3.55
0.53
2.79
7.74
*3.00
8.81
Marking:
6.29
9.22
-
6
3
5
4
8
1
7
2
B
R S
P
A
C
D
E
2 0 4 2
-
Date Code
Control Code
-
B
Note: Green label is used for pb-free packing
F
3.25
3.17
0.38
2.28
7.49
-
J
G
H
I
Material:
F
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
J
α1
K
L
K
E
C
G
H
L
8.56
M
M
α1
0.229
94o
0.381
97o
D
I
*: Typical, Unit: mm
8-Lead DIP-8
Plastic Package
Package Code: P
SOP-8L Dimension
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
Min.
4.85
3.85
5.80
1.22
0.37
3.74
1.45
4.80
0.05
0.30
0.19
0.37
0.23
0.08
0.00
Max.
5.10
3.95
6.20
1.32
0.47
3.88
1.65
5.10
0.20
0.70
0.25
0.52
0.28
0.13
0.15
Marking:
A
G
R S
2 0 4 2
S
I
8
7
6
5
4
Pin 1 Index
Date Code
Control Code
C
B
H
Pin1 Index
Note: Green label is used for pb-free packing
2
3
Material:
J
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
D
E
K
Part A
L
Part A
N
M
*: Typical, Unit: mm
O
F
8-Lead SO-8 Plastic
Surface Mounted Package
Package Code: S
Ordering Information
PART NUMBER
RS2042P
PIN-PACKAGE
DIP-8L
RS2042S
SOP-8L
DS-RS2042-01 May, 2007
www.Orister.com
ORISTER [ ORISTER CORPORATION ]
