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DIP-8 Dimension
Marking:
8
7
6
5
DIM
A
B
C
D
Control Code
Min.
6.29
9.22
-
-
-
3.25
3.17
0.38
2.28
7.49
-
8.56
0.229
o
94
Max.
6.40
9.32
*1.52
*1.27
*0.99
3.35
3.55
0.53
2.79
7.74
*3.00
8.81
0.381
o
97
A
1
2
3
4
RS
1 0 3
Pin 1 Index
Date Code
P
E
F
G
H
I
J
K
L
M
B
J
F
Note: Green label is used for pb-free packing
C
E
D
G
H
α
1 K
M
L
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
I
α1
8-Lead DIP-8
Plastic Package
Package Code: P
*: Typical, Unit: mm
SOP-8 Dimension
A
G
Marking:
DIM
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
Min.
4.85
3.85
5.80
1.22
0.37
3.74
1.45
4.80
0.05
0.30
0.19
0.37
0.23
0.08
0.00
Max.
5.10
3.95
6.20
1.32
0.47
3.88
1.65
5.10
0.20
0.70
0.25
0.52
0.28
0.13
0.15
8
B
7
6
5
C
4
J
H
I
Pin 1 Index
Date Code
RS
1 0 3
S
Control Code
Pin1 Index
2
3
Note: Green label is used for pb-free packing
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
D
E
Part A
K
L
N
O
Part A
M
*: Typical, Unit: mm
F
8-Lead SOP-8 Plastic
Surface Mounted Package
Package Code: S
Ordering Information
PART NUMBER
RS103P
RS103S
PIN-PACKAGE
DIP-8
SOP-8
DS-RS103-01
Nov, 2007
www.Orister.com
ORISTER [ ORISTER CORPORATION ]
