5.6 x 3.0 x 0.9mm SMD
OSXX5630C1A-150mA
Ver.A.1
■
Recommended
Reflow Soldering Profile
Surface mounting condition
In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces
or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical
damages of the devices.
Soldering reflow
-Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications.
-SMD LEDs are designed for reflow soldering.
-In the reflow soldering, too high temperature and too large temperature gradient such as rapid
heating/cooling may cause electrical & optical failures and damages of the devices.
-Wellypower can’t guarantee the LEDs after they have been assembled using the solder dipping method.
LED & Application Technologies
http://www.optosupply.com
VER A.0
OPTOSUPPLY [ OptoSupply International ]
