MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−23 5−LEAD
CASE 1212−01
ISSUE A
SCALE 2:1
A
A1
L
5X
DATE 28 JAN 2011
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DATUM C IS THE SEATING PLANE.
DIM
A
A1
A2
b
c
D
E
E1
e
L
L1
MILLIMETERS
MIN
MAX
---
1.45
0.00
0.10
1.00
1.30
0.30
0.50
0.10
0.25
2.70
3.10
2.50
3.10
1.50
1.80
0.95 BSC
0.20
---
0.45
0.75
A
5
1
D
4
2
3
B
A2
0.05
S
E
L1
e
E1
b
0.10
C
M
C B
S
A
S
C
RECOMMENDED
SOLDERING FOOTPRINT*
GENERIC
MARKING DIAGRAM*
XXX MG
G
3.30
0.85
5X
0.56
5X
0.95
PITCH
DIMENSIONS: MILLIMETERS
XXX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “
G”,
may or may not be present.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
98ASH70518A
ON SEMICONDUCTOR STANDARD
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OF
XXX
2
©
Semiconductor Components Industries, LLC, 2002
October,
DESCRIPTION:
2002
−
Rev. 0
SOT−23 5−LEAD
ONSEMI [ ON SEMICONDUCTOR ]
