1.5SMC6.8AT3 Series
PACKAGE DIMENSIONS
SMC
CASE 403−03
ISSUE B
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
D
B
INCHES
DIM MIN MAX
MILLIMETERS
MIN
6.60
5.59
1.90
2.92
0.051
0.15
0.76
MAX
7.11
6.10
2.41
3.07
0.152
0.30
1.27
A
B
C
D
H
J
0.260
0.220
0.075
0.115
0.280
0.240
0.095
0.121
0.0020 0.0060
0.012
0.050
0.006
0.030
K
P
S
C
0.020 REF
0.51 REF
0.305
0.320
7.75
8.13
J
H
K
P
SOLDERING FOOTPRINT*
4.343
0.171
3.810
0.150
2.794
0.110
mm
inches
ǒ
Ǔ
SCALE 4:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
ONSEMI [ ONSEMI ]
