PEDR26T51203L-02-04
OKI Semiconductor
MR26T51203L / P2ROM
PACKAGE DIMENSIONS
(Unit: mm)
P-SSOP70-500-0.80-K-MC
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
2.15 TYP.
5
1/Nov. 13, 2002
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
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