FEDL7055-02
OKI Semiconductor
ML7055
SPECIFICATIONS
Process
Package
0.16 µm CMOS (5-layer metal wire)
63-pin WCSP (P-VFLGA63-4.90×4.72-0.50-W)
(Dimensions: 4.90 mm × 4.72 mm × 0.48 mm; pin pitch: 0.50 mm)
64-pin BGA (P-TFBGA64-0707-0.65)
(Dimensions: 7 mm × 7 mm × 1.2 mm; pin pitch: 0.65 mm)
84-pin BGA (P-LFBGA84-0909-0.80)
(Dimensions: 9 mm × 9 mm × 1.5 mm; pin pitch: 0.80 mm)
22 mA (24 MHz operation)
Supply current
Operating voltage ranges
2.70 to 3.6 V for input-output, 1.65 to 1.95 V for internal circuits
24 MHz
Operating frequency
Built-in ROM size
Built-in RAM size
Input clocks
176 KB (for ARM program)
24 KB
12 MHz or 13 MHz (system clock)
32 kHz or 32.768 kHz (LPO clock)
RF-LSI interface
OKI RF-LSI interface (ML7050)
SKYWORKS RF-LSI interface (CX72303)
BROADCOM RF-LSI interface (BCM2002X)
UART interface (up to 921.6 Kbps)
Installed interfaces
General-purpose I/O interface (used as a pin for I2C bus interface
depending on software installed)
PCM interface (PCM Linear/A-law/µ-law can be selected)
DETACH interface
Timers
16-bit auto reload timer (1ch)
18-bit auto reload timer (1ch)
Interrupt controller
Clock control circuit
11 causes
Crystal oscillator circuit (12 MHz or 13 MHz, 32 kHz or 32.768 kHz)
Internal PLL
2/30
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