FEDL2500-01
ML2500
¡ Semiconductor
PACKAGE DIMENSIONS
TSOPI32-P-814-0.50-1K
(Unit : mm)
Mirror finish
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5 mm)
0.27 TYP.
3/Dec. 10, 1996
Oki Electric Industry Co., Ltd.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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OKI [ OKI ELECTRONIC COMPONETS ]
