MBF9060BB 参数 Datasheet PDF下载

FEDL9060BB-01

1

Semiconductor

MBF9060BB

REFLOW TEMPERATURE PROFILE

The figure below shows recommended temperature profile of infrared reflow and air reflow. Other type of reflow

is not recommended.

The maximum reflow count is 2 times. Washing of this device after reflow process is prohibited.

250

1 to 4°C/sec.

Package surface Temperature (°C)

200

Preheat temperature:

120 to 150°C

150

40 to 60 sec.

100

20 sec.max

235 to 240°C,

20 sec. max.

1 to 4°C/sec.

50

2 to 5°C/sec.

Time (sec.)

6/9