ODHKGL4136HD-04
KGL4136HD
1
Electronic Components
Assembly and ESD Considerations
Mounting Process:
ꢀ The heat sink on the backside of IC package is recommended to have a good thermal path to
the electrically grounding metal on the PC board using a conductive adhesive, such as silver
paste. If conductive adhesive is not used, a thin thermal and electrically conductive film is
recommended to between the IC and PC board.
Soldering Process:
ꢀ Soldering such that the heating area is spatially confined only in the vicinity of IC leads is
recommended.
ꢀ The soldering condition is either shorter than 10 seconds at the lead temperature of lower
than 260 degC, or shorter than 3 seconds at the temperature of lower than 310 degC.
ꢀ During soldering, pre-heating of PC board is required. The recommended temperature is in
the range between 120 degC and 150 degC. If the temperature is lower than that, "solder
balls" may occur.
ꢀ A soldering iron with electrical isolation higher than 10M ohm as well as a small leakage
voltage is recommended.
ESD Considerations:
ꢀ This device can be damaged by ESD; therefore appropriate precautions must be taken to
avoid exposure to ESD and EOS during handling, assembly, and testing of these devices.
Failure to adhere to proper ESD/EOS precautions during handling and assembly of these
devices can damage or adversely affect device reliability.
SAFETY AND HANDLING INFORMATION FOR GaAs DEVICES
Arsenic Compound (GaAs Devices)
The product contains arsenic (As) as a compound.
This material is stable for normal use; however, its dust or vapor may be potentially hazardous to the human
body.
Avoid ingestion, fracture, burning or chemical treatment to the product.
• Do not put the product in your mouth.
• Do not burn or destroy the product.
• Do not perform chemical treatment for the product.
Keep laws and ordinances related to the disposal of the products.
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OKI [ OKI ELECTRONIC COMPONETS ]
