M1.5KE6.8A – M1.5KE400CA(e3)
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance, Junction to Lead @ 0.375 inch (10
mm) from body
(1)
Thermal Resistance, Junction to Ambient
(2)
Peak Pulse Power @ T
L
= +25 ºC
Rated Average Power Dissipation
@ T
L
= +40 ºC
@ T
A
= +25 ºC
Unidirectional
T
clamping
(0 volts to V
(BR)
min)
Bidirectional
Surge Peak Forward Current
Solder Temperature @ 10 s
(3)
Symbol
T
J
and T
STG
R
ӨJL
R
ӨJA
P
PP
P
M(AV)
Value
-65 to +150
22
82
1500
5
(1)
1.52
< 100
<5
200
260
Unit
ºC
ºC/W
ºC/W
W
W
ps
ns
A
o
I
FSM
T
SP
C
Notes:
1. When mounted on FR4 PC board with 4 mm
2
copper pads (1 oz) and track width 1 mm, length 25 mm.
2. At 10/1000
µs
with repetition rate of 0.01% or less (see
3. At 8.3 ms half-sine wave for unidirectional devices only.
MECHANICAL and PACKAGING
•
•
•
•
•
•
•
CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0
TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating readily solderable per MIL-STD-750 method 2026
MARKING: Part number and polarity band
POLARITY: Cathode indicated by band. No cathode band on bidirectional devices.
TAPE & REEL option: Standard per EIA-296 (add “TR” suffix to part number). Consult factory for quantities.
WEIGHT: Approximately 1.5 grams
See
on last page.
PART NOMENCLATURE
M
Reliability Level*
M
MA
MX
MXL
(*See
Peak Pulse Power
Kilowatt Rating
Encapsulated Plastic Package
1.5
K
E
6.5
C
A
(e3)
RoHS Compliance
e3 = RoHS compliant
Blank = non-RoHS compliant
+/- 5% Tolerance Level
Polarity
C = Bi-directional
Blank = Unidirectional
Nominal Breakdown Voltage
(See
table)
RF01008, Rev. E (11/15/13)
©2013 Microsemi Corporation
Page 2 of 7
MICROSEMI [ MICROSEMI CORPORATION ]
