®
X2Y FILTER & DECOUPLING
CAPACITORS
SOLDER
PAD
RECOMMENDATIONS
0402 (X07)
IN mm
0603 (X14)
0805 (X15)
1206 (X18)
1210 (X41)
1410 (X44)
1812 (X43)
IN
mm
IN
mm
1.27
0.89
1.27
0.56
2.03
3.05
IN
mm
1.65
1.02
2.03
1.02
3.05
4.06
IN
mm
IN
mm
IN
mm
0.020
0.020
0.024
0.015
0.039
0.064
0.51
0.51
0.61
0.38
0.99
1.63
0.03 0
0.025
0.040
0.020
0.060
0.090
0.76
0.64
1.02
0.51
1.52
2.29
0.050
0.035
0.050
0.022
0.080
0.120
0.065
0.040
0.080
0.040
0.120
0.160
0.100
0.040
0.080
0.045
0.160
0.160
2.54
1.02
2.03
1.14
4.06
4.57
0.100
0.040
0.100
0.045
0.160
0.180
2.54
1.02
2.54
1.14
4.06
4.57
0.125
0.040
0.130
0.045
0.190
0.210
3.18
1.02
3.30
1.14
4.83
5.33
X
Y
G
V
U
Z
Z
Z
V
V
U
U
X
X
V
V
V
V
V
V
Y
G
Y
G
OPTIMIZING X2Y PERFORMANCE WITH
P
ROPER
ATTACHMENT
TECHNIQUES
X2Y® capacitors excel in low inductance performance for a myriad of appli-
cations including EMI/RFI filtering, power supply bypass / decoupling. How
the capacitor is attached to the application PCB is every bit as important as
the capacitor itself. Proper attention to pad layout and via placement insures
superior device performance. Poor PCB layouts squander performance, requir-
ing more capacitors, and more vias to do the same job. Figure 1 compares the
X2Y® recommended layout against a poor layout. Because of its long extents
from device terminals to vias, and the wide via separation, the poor layout
shown performs badly. It exhibits approximately 200% L1 inductance, and
150% L2 inductance compared to recommended X2Y® layouts.
Good Layout
Poor Layout
Figure 1
For further details on via placement and it’s effect on mounted inductance,
please refer to X2Y Attenuators, LLC. application note #3008 “Get the Most
from X2Y Capacitors with Proper Attachment Techniques” at www.x2y.com
7
www.johansondielectrics.com
JOHANSON [ JOHANSON TECHNOLOGY INC. ]
