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101X18N223MV4E 参数 Datasheet PDF下载

101X18N223MV4E图片预览
型号: 101X18N223MV4E
PDF下载: 下载PDF文件 查看货源
内容描述: [Ceramic Capacitor, Ceramic, ROHS COMPLIANT, EIA STD PACKAGE SIZE 1206, 3 PIN]
分类和应用: 电容器
文件页数/大小: 8 页 / 740 K
品牌: JOHANSON [ JOHANSON TECHNOLOGY INC. ]
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®
X2Y FILTER & DECOUPLING  
CAPACITORS  
OPTIMIZING X2Y PERFORMANCE  
X2Y® low inductance capacitors deliver excellent performance in EMI/RFI filtering and power delivery bypass / decoupling applica-  
tions. Physical and electrical placement on the PCB is critical in achieving best results.  
In EMI Filter applications stray inductance should be minimized between signals and the A and B capacitor pads. Use star or daisy  
chain routes, rather than “T” to capacitor pads as shown in Figure 1.  
For PDN bypass applications Figure 2 compares the X2Y® recommended layout against a poor layout. Because of its long extents  
from device terminals to vias, and the wide via separation, the poor layout exhibits approximately 200ꢀ L1 inductance, and 150ꢀ L2  
inductance compared to recommended X2Y layouts.  
As with any ceramic capacitor, hand soldering is discouraged due to the risk of thermal crack failure. If hand soldering is employed for  
lab evaluation, pre-heat the assembly and utilize contact-less soldering methods such as a hot air tool.  
Figure 1: EMI Filtering Recommended Layouts  
Figure 2: Decoupling Layout  
Good Layout  
Poor Layout  
SOLDER  
P
AD  
0402 (X07)  
IN mm  
R
ECOMMENDATIONS  
0603 (X14)  
IN mm  
0805 (X15)  
IN mm  
1206 (X18)  
IN mm  
1210 (X41)  
IN mm  
1410 (X44)  
IN mm  
1812 (X43)  
IN mm  
Z
X
Y
G
V
0.020 0.51 0.035 0.89 0.050 1.27 0.065 1.65 0.100 2.54 0.100 2.54 0.125 3.18  
0.020 0.51 0.025 0.64 0.035 0.89 0.040 1.02 0.040 1.02 0.040 1.02 0.040 1.02  
0.024 0.61 0.040 1.02 0.050 1.27 0.080 2.03 0.080 2.03 0.100 2.54 0.130 3.30  
0.015 0.38 0.020 0.51 0.022 0.56 0.040 1.02 0.045 1.14 0.045 1.14 0.045 1.14  
0.039 0.99 0.060 1.52 0.080 2.03 0.120 3.05 0.160 4.06 0.160 4.06 0.190 4.83  
0.064 1.63 0.090 2.29 0.120 3.05 0.160 4.06 0.160 4.06 0.180 4.57 0.210 5.33  
Use of solder mask beneath component is not recommended because of flux/contaminant entrapment.  
U
X
V
U
Z
V
Y
G
MECHANICAL  
CHARACTERISTICS  
0402 (X07)  
0603 (X14)  
0805 (X15)  
1206 (X18)  
1210 (X41)  
1410 (X44)  
1812 (X43)  
IN  
mm  
IN  
mm  
IN  
mm  
IN  
mm  
IN  
mm  
IN  
mm  
IN  
mm  
0.045  
0.003  
1.143  
0.076  
0.064  
0.005  
1.626  
0.127  
0.080  
0.008  
2.032  
0.203  
0.124  
0.010  
3.150  
0.254  
0.125  
0.010  
3.175  
0.254  
0.140  
0.010  
3.556  
0.254  
0.174  
0.010  
4.420  
0.254  
L
W
T
0.024  
0.003  
0.610  
0.076  
0.035  
0.005  
0.889  
0.127  
0.050  
0.008  
1.270  
0.203  
0.063  
0.010  
1.600  
0.254  
0.098  
0.010  
2.489  
0.254  
0.098  
0.010  
2.490  
0.254  
0.125  
0.010  
3.175  
0.254  
0.020  
max  
0.508  
max  
0.026  
max  
0.660  
max  
0.040  
max  
1.016  
max  
0.050  
max  
1.270  
max  
0.070  
max  
1.778  
max  
0.070  
max  
1.778  
max  
0.090  
max  
2.286  
max  
0.008  
0.003  
0.203  
0.076  
0.009  
0.004  
0.229  
0.102  
0.009  
0.004  
0.229  
0.102  
0.009  
0.004  
0.229  
0.102  
0.009  
0.005  
0.229  
0.127  
0.009  
0.005  
0.229  
0.127  
0.009  
0.005  
0.229  
0.127  
EB  
CB  
0.010  
0.003  
0.305  
0.076  
0.018  
0.004  
0.457  
0.102  
0.022  
0.005  
0.559  
0.127  
0.040  
0.005  
1.016  
0.127  
0.045  
0.005  
1.143  
0.127  
0.045  
0.005  
1.143  
0.127  
0.045  
0.005  
1.143  
0.127  
6
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