High Frequency Ceramic Solutions
Sub-GHz Impedance Matched Balun + LPF integrated Passive
P/N: 0850BM14E0016
Component for Texas Instruments' CC1310, CC1312 Chipsets
3/22/2018
Detail Specification:
Page 3 of 5
Pad-Soldermask Guidelines
Request reference design, schematic, and gerber files at: www.johansontechnology.com/ask-a-question
GND
Solder Resist
Land
Through-hole ( 0.35)
0.25mm
0.55mm
(0.6mm max.)
Vias are important for
proper harmonic
attenuation!
0.6mm
0.45mm
*
Even though Pins 3, 4, and 1 are DC blocked from GND, Pins 3/4 are DC coupled to Pin 1 (there’s a DC path between
them). We recommend the designer place a DC blocking cap (68-100pF) in series after Pin 1 (between IPC and antenna)
per page 2 of the datasheet.
*
Line width should be designed to match 50ohm characteristic impedance, depending on PCB material and thickness.
Grounded CPWG is recommended.
Measurement Diagram
Port 1:Unbalanced Port
Ports 2 and 4: Balanced Port
*Ports 2 and 4 Terminate impedance
=Conjugate match to TI CC13XX chipset
Port 3: RX_TX Port
Port 2*
Port 1(50 W)
Network
Analyzer**
Port 3**
Port 4*
**Port 3 Terminate impedance
=The load Impedance looking into
RX_TX pin of TI CC13XX chipset
IL=SDS21
RL=SSS11
GND
GND
Amp_balance = dB(S(2,1)/S(4,1))
Phase_balance = Phase(S(2,1)/S(4,1))
Johanson Technology, Inc. reserves the right to make design changes without notice.
All sales are subject to Johanson Technology, Inc. terms and conditions.
www.johansontechnology.com
4001 Calle Tecate • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821
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