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0850BM14E0016T 参数 Datasheet PDF下载

0850BM14E0016T图片预览
型号: 0850BM14E0016T
PDF下载: 下载PDF文件 查看货源
内容描述: [Sub-GHz Impedance Matched Balun LPF integrated Passive]
分类和应用:
文件页数/大小: 5 页 / 520 K
品牌: JOHANSON [ JOHANSON TECHNOLOGY INC. ]
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High Frequency Ceramic Solutions  
Sub-GHz Impedance Matched Balun + LPF integrated Passive  
P/N: 0850BM14E0016  
Component for Texas Instruments' CC1310, CC1312 Chipsets  
3/22/2018  
Detail Specification:  
Page 3 of 5  
Pad-Soldermask Guidelines  
Request reference design, schematic, and gerber files at: www.johansontechnology.com/ask-a-question  
GND  
Solder Resist  
*
*
Land  
Through-hole (0.35)  
0.25mm  
0.55mm  
(0.6mm max.)  
Vias are important for  
proper harmonic  
attenuation!  
0.6mm  
0.45mm  
*
Even though Pins 3, 4, and 1 are DC blocked from GND, Pins 3/4 are DC coupled to Pin 1 (there’s a DC path between  
them). We recommend the designer place a DC blocking cap (68-100pF) in series after Pin 1 (between IPC and antenna)  
per page 2 of the datasheet.  
*
Line width should be designed to match 50ohm characteristic impedance, depending on PCB material and thickness.  
Grounded CPWG is recommended.  
Measurement Diagram  
Port 1:Unbalanced Port  
Ports 2 and 4: Balanced Port  
*Ports 2 and 4 Terminate impedance  
=Conjugate match to TI CC13XX chipset  
Port 3: RX_TX Port  
Port 2*  
Port 1(50 W)  
Network  
Analyzer**  
Port 3**  
Port 4*  
**Port 3 Terminate impedance  
=The load Impedance looking into  
RX_TX pin of TI CC13XX chipset  
IL=SDS21  
RL=SSS11  
GND  
GND  
Amp_balance = dB(S(2,1)/S(4,1))  
Phase_balance = Phase(S(2,1)/S(4,1))  
Johanson Technology, Inc. reserves the right to make design changes without notice.  
All sales are subject to Johanson Technology, Inc. terms and conditions.  
www.johansontechnology.com  
4001 Calle Tecate • Camarillo, CA 93012 • TEL 805.389.1166 FAX 805.389.1821  
Ver. 2.3  
2018 Johanson Technology, Inc. All Rights Reserved