Top View
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
16.125mm
Socket Lid: Black anodized 6061 Aluminum.
Thickness = 2.5mm.
1
2
A
A
Socket base: Black anodized 6061 Aluminum.
Thickness = 5mm.
Compression Plate: Black anodized 6061 Aluminum.
Thickness = 2.5mm.
3
Compression screw: Clear anodized 6061 Aluminum.
Thickness = 5mm, Hex socket = 5mm.
4
5
Side View
(Section AA)
16.125mm
Elastomer: 20 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
Socket lid screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 4.76mm long.
6
1
4
6
3
Assembled
8.0mm +
IC thickness
2
Epoxy
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
Customer's
BGA IC
5
Customer's Target PCB
Scale: -
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
Status: Released
Drawing: H. Hansen
File: SG-BGA-7026 Dwg
Rev: C
SG-BGA-7026 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
Date: 10/20/04
Modified: 07/30/14
PAGE 1 OF 4
www.ironwoodelectronics.com
IRONWOOD [ IRONWOOD ELECTRONICS. ]
