GHz BGA Socket - Direct mount, solderless
Features
Top View
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
15.225mm
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
1
2
A
A
Socket base: Black anodized Aluminum.
Thickness = 5mm.
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
3
4
5
Compression screw: Black anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
15.225mm
Side View
Recommended torque = 0.38 in-lb
(6 in-oz.)
(Section AA)
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
4
1
Thickness = 0.75mm.
9
3
Elastomer Guide: Non-clad FR4.
Thickness = 0.725mm.
6
7
8
Assembled
8.25mm +
IC thickness
Ball Guide: Kapton polyimide.
2
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
8
7
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
9
Socket base nut: 18-8 Stainless steel, 0-80 fine thread.
Nylon washer: 1.73mm ID; 4.78mm OD, 0.64mm thick
10
6
5
11
Customer's
BGA IC
10
11
Customer's Target PCB
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
Scale: NA
Status: Released
Rev: F
SG-BGA-6021 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
Drawing: H. Hansen
File: SG-BGA-6021 Dwg.mcd
Date: 11/26/01
Modified: 6/2/09 AE
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