GHz BGA Socket - Direct mount, solderless
Features
Top View
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
47.725mm
A
A
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
1
2
Socket base: Black anodized Aluminum.
Thickness = 6.5mm.
Compression Plate: Black anodized Aluminum.
Thickness = 4.0mm.
3
47.725mm
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
4
5
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Recommended torque = 26 in lbs./
416 in oz.
4
Thickness = 0.75mm.
1
9
Elastomer Guide: Cirlex or equivalent.
Thickness = 0.725mm.
3
6
7
8
Assembled
10.11mm +
IC thickness
Ball Guide: Kapton polyimide.
2
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
8
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
7
9
Insulation Plate: FR4/G10, Thickness = 1.59mm.
10
11
Side View
(Section AA)
10
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
6
5
Customer's
BGA IC
11
Customer's Target PCB
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
Scale: -
Status: Released
Rev: H
Date: 8/20/01
Modified: 7/16/09, AE
SG-BGA-6016 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
Drawing: Meghann Fedde
File: SG-BGA-6016 Dwg
PAGE 1 of 4
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