PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
9.00
A1 Mark
6.40
13.00
12.00
0.80 typ
ITEM NO.
DESCRIPTION
TOP VIEW
1
High Temp Substrate
2
3
High Density Giga-Snap Receptacle
Solder Ball, 0.4572mm dia (See Table)
2.56±0.25
0.3600
FRONT VIEW
PART NO.
SOLDER BALL ALLOY
SUFFIX
-64
Sn63Pb37
Description: SF-BGA96G-B-64F Gigasnap
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
-64F*
Sn96.5Ag3.0Cu0.5
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
*RoHS Compliant
SF-BGA96G-64 Drawing
STATUS: Released
ENG: M.A. Fedde
SHEET: 1 OF 2
REV. B
SF-BGA96G-B-64F Drawing
Material: N/A
Finish: N/A
Weight: 0.56
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
DRAWN BY: D. Hauer
DATE: 11/15/13
SCALE: 5:1
FILE: SF-BGA096G-64F
IRONWOOD [ IRONWOOD ELECTRONICS. ]
