PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
2
3
1
10.000
A1
0.80 TYP
10.000
8.00
ITEM NO.
DESCRIPTION
1
2
3
High Temp Substrate
High Density Giga-Snap Receptacle
Solder Ball, 0.4572mm dia (See Table)
8.00
TOP VIEW
PART NO.
SOLDER BALL ALLOY
SUFFIX
2.56±0.25
0.36
-64
Sn63Pb37
-64F*
Sn96.5Ag3.0Cu0.5
SIDE VIEW
*RoHS Compliant
Description: Giga-snaP BGA SMT Foot
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA96D-B-64 Drawing
STATUS: Released
SHEET: 1 OF 2
SCALE: 5:1
REV. B
SF-BGA96D-B-64F Drawing
Material: N/A
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Finish: N/A
DRAWN BY: M. Raske
Weight: 0.46 grams
FILE: SF-BGA096D-B-64 Dwg
DATE: 04/13/2012
IRONWOOD [ IRONWOOD ELECTRONICS. ]
