Patent Pending
31.00mm
[1.220"]
Top View
1.00mm
[0.039"]
Ordering Information:
1.00mm
[0.039"]
Solder Ball Alloy
Part Number Suffix
Sn63Pb37
-42
1mm typ.
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
-42F*
1.33mm
[0.052"]
2.36mm
[0.093"]
Side View
2
Detail A
Detail A
3
2.87mm
[0.113"]
1
4
0.51mm
[0.020"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material. (RoHS)
1
2
CONTACT DATA
Accepts 0.20mm - 0.33mm Diameter pins
3-finger
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
37/25 gram, Initial insertion force (with 0.254mm/0.203mm dia. pin)
30/22 gram, normal force (with 0.254mm/0.203mm dia. pin)
20/17 gram, extraction force (with 0.254mm0.203mm dia. pin)
Contacts: Beryllium Copper Alloy172, HT; Finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
3
4
Solder Balls (See table above)
Description: Giga-snaP BGA SMT Foot
900 position (1.0mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
Scale: 3:1
Status: Released
Rev: C
SF-BGA900A-B-42(F) Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
Drawing: S.Natarajan
File: SF-BGA900A-B-42 Dwg
Date: 3/4/05
Modified: 1/9/06
www.ironwoodelectronics.com
IRONWOOD [ IRONWOOD ELECTRONICS. ]