PROPRIETARY AND CONFIDENTIAL - THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF IRONWOOD ELECTRONICS, INC. ANY REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF IRONWOOD ELECTRONICS, INC. IS PROHIBITED.
U.S. Patent No. 8,091,222 B2
3
2
27.000
1
A1
0.80 TYP
24.80
27.000
ITEM
DESCRIPTION
NO.
Material
1
2
3
0.018" dia 63sn37pb solder ball
63SN37PB alloy solder
Shell: Brass Alloy 360; 0.25µm [10µ”]
Au over 2.54 µm [100µ”] Ni finish
Contact: BeCu Alloy 172; 0.25µm [10µ”]
Au over 1.27 µm [50µ”] Ni finish
High Density Giga-Snap
Receptacle
P-S527A, 0.8mm Giga-snaP
receptacle
SEE TABLE
24.80
TOP VIEW
SIDE VIEW
2.71±0.25
PART NO.
SOLDER BALL ALLOY
SUFFIX
-64
-64F*
Sn63Pb37
Sn96.5Ag3.0Cu0.5
*RoHS Compliant
0.36
Description: Giga-snaP BGA SMT Foot 27x27mm 0.8mm pitch BGA768
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SF-BGA768B-B-64 Drawing
SF-BGA768B-B-64F Drawing
STATUS: Released
SHEET: 1 OF 2
SCALE: 3:1
REV. A
Material: N/A
Finish: N/A
Weight: N/A
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
DRAWN BY: M. Raske
FILE: SF-BGA768B-B-64 Dwg
DATE: 06/10/2015
IRONWOOD [ IRONWOOD ELECTRONICS. ]
